Solid adhesive composition

ABSTRACT

A solid adhesive composition which has an excellent applying performance even after an applying part of the solid adhesive is left to stand in the atmosphere for a long time and which is excellent in a cap-off performance and which comprises at least an adhesive component, a gelling agent and a solvent, wherein contained in the above composition are at least one selected from the group consisting of waxes such as paraffin waxes and olefin waxes which are a solid at room temperature and have a solubility of 20% or less in the solvent at room temperature and/or a substance absorbing moisture contained at least in the atmosphere and/or the adhesive composition to form an evaporation-inhibiting film.

TECHNICAL FIELD

[0001] The present invention relates to a solid adhesive compositionhaving an excellent applying performance even after an applying part ofthe solid adhesive is left to stand in the atmosphere for a long time.

BACKGROUND ART

[0002] Conventional solid adhesive compositions such as solid pasteshave such a defect that if they are left in a cap-off state, thesolvents evaporate, and the adhesive resins contained in the pastes aresolidified on the surface layer of the applying part, so that the pastesare less liable to be applied when used next time.

[0003] In order to avoid this state, it has so far been tried to addscarcely-volatile solvents or change the composition of an adhesiveresin, but the problem therewith is that a drying time for an appliedpaste is extended or the adhesive strength is lowered.

[0004] Disclosed in Japanese Patent Application Laid-Open No. Sho53-42343 and Japanese Patent Application Laid-Open No. Sho 53-67739 areadhesive compositions suited particularly to flooring materials, forexample, vinyl chloride-made tiles which are improved in an adheringworkability by blending organic solvent solutions of vinyl acetate basepolymers with glycerin monostearate, diglycerin monostearate anddiglycerin distearate to extend open time (time spent until stucktogether after applied and left uncovered) in Japanese PatentApplication Laid-Open No. Sho 53-42343 and usable time (time spent untilit becomes impossible to use adhesives from the time of preparing them)in Japanese Patent Application Laid-Open No. Sho 53-67739.

[0005] However, the adhesives disclosed in these official gazettes areadhesives of a solution type prepared by dissolving vinyl acetate basepolymers in organic solvents.

[0006] On the other hand, disclosed in Japanese Patent ApplicationLaid-Open No. Sho 61-293276 are solid pastes for office uses prepared bymixing 60 to 100 parts by weight of resins such as petroleum resins andnatural resins with 100 parts by weight of waxes such as paraffin,stearic acid, carnauba wax and low molecular weight polyethylene waxusing plasticizers such as dioctyl phthalate and dibutyl phthalate incombination therewith.

[0007] However, in the solid pastes for office uses disclosed in thisofficial gazette, solvents and water are avoided being blended in orderto remove a factor of losing the adhesive function caused by evaporationof the solvents and water. In addition thereto, it is positivelydisclosed that wax is used as a base material.

[0008] In light of the problems of the conventional techniques describedabove, the present invention intends to solve them, and an object of thepresent invention is to provide a solid adhesive composition having anexcellent applying performance even after an applying part of the solidadhesive is left to stand in the atmosphere for a long time.

DISCLOSURE OF THE INVENTION

[0009] Intensive investigations of the problems on the conventionaltechniques described above repeated by the present inventors haveresulted in finding that a solid adhesive composition meeting the objectdescribed above can be obtained by adding a specific substance to asolid adhesive composition containing at least an adhesive component, agelling agent and a solvent, and the present invention has come to becompleted.

[0010] That is, the solid adhesive composition of the present inventioncomprises the following items (1) to (8).

[0011] (1) A solid adhesive composition comprising at least an adhesivecomponent, a gelling agent and a solvent, wherein contained in the abovecomposition is at least one selected from the group consisting of waxeswhich are a solid at room temperature and have a solubility of 20% orless in the solvent at room temperature.

[0012] (2) A solid adhesive composition having an excellent cap-offperformance, comprising at least an adhesive component, a gelling agentand a solvent, wherein contained in the above composition is a substanceabsorbing moisture contained at least in the atmosphere and/or theadhesive composition to form an evaporation-inhibiting film.

[0013] (3) A solid adhesive composition comprising at least an adhesivecomponent, a gelling agent and a solvent, wherein contained in the abovecomposition are at least one selected from the group consisting of waxeswhich are a solid at room temperature and have a solubility of 20% orless in the solvent at room temperature and a substance absorbingmoisture contained at least in the atmosphere and/or the adhesivecomposition to form an evaporation-inhibiting film.

[0014] (4) The solid adhesive composition as described in the above item(1) or (3), wherein the waxes which are a solid at room temperature andhave a solubility of 20% or less in the solvent at room temperature areat least one selected from the group consisting of paraffin waxes,olefin waxes, microcrystalline waxes, petrolatum, animal waxes,vegetable waxes, mineral waxes, polyethylene waxes and Fisher.Tropschwaxes.

[0015] (5) The solid adhesive composition as described in the above item(2) or (3), wherein the substance absorbing moisture contained at leastin the atmosphere and/or the adhesive composition to form anevaporation-inhibiting film is at least one selected from the groupconsisting of glycerin fatty acid esters, polyglycerin fatty acidesters, alkyl phosphates, polyoxyalkylene fatty acid esters, sorbitanfatty acid esters, polyoxyalkylene sorbitan fatty acid esters, sorbitfatty acid esters, polyoxyalkylene sorbit fatty acid esters andlecithin.

[0016] (6) The solid adhesive composition as described in the above item(1) or (4), wherein the waxes have a content of 0.1 to 15% by weightbased on the total amount of the composition.

[0017] (7) The solid adhesive composition as described in the above item(2) or (5), wherein the substance absorbing moisture contained at leastin the atmosphere and/or the adhesive composition to form anevaporation-inhibiting film has a content of 0.01 to 10% by weight basedon the total amount of the composition.

[0018] (8) The solid adhesive composition as described in any of theabove items (3) to (5), wherein a content ratio of the waxes to thesubstance absorbing moisture contained at least in the atmosphere and/orthe adhesive composition to form an evaporation-inhibiting film is 1/1to 100/1 in terms of a weight ratio, and the total content thereof is0.1 to 10% by weight based on the total amount of the composition.

BRIEF DESCRIPTION OF THE DRAWINGS

[0019]FIG. 1 is a cross section showing one example of a use state ofthe solid adhesive composition of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

[0020] The embodiments of the present invention shall be explained belowin details.

[0021] The solid adhesive composition in the first embodiment of thepresent invention is a solid adhesive composition comprising at least anadhesive component, a gelling agent and a solvent, wherein contained inthe above composition is at least one selected from the group consistingof waxes which are a solid at room temperature and have a solubility of20% or less in the solvent at room temperature. In the secondembodiment, a substance absorbing moisture contained at least one in theatmosphere and/or the adhesive composition to form anevaporation-inhibiting film is contained in the composition describedabove comprising at least an adhesive component, a gelling agent and asolvent. In the third embodiment, contained in the composition describedabove are at least one selected from the group consisting of waxes whichare a solid at room temperature and have a solubility of 20% or less inthe solvent at room temperature and a substance absorbing moisturecontained at least in the atmosphere and/or the adhesive composition toform an evaporation-inhibiting film.

[0022] The adhesive components used in the first to third embodiments(hereinafter referred to merely as “embodiment”) of the presentinvention shall not specifically be restricted, and adhesive componentswhich have so far been used for solid adhesives can be used. Theyinclude, for example, synthetic resins such as polyvinylpyrrolidone,polyvinyl alcohol, polyacrylates, polymethacrylates, polyvinyl acetateand polyvinylbutyral each having an average molecular weight of 10,000to 3,000,000, celluloses such as methyl cellulose and ethyl celluloseand natural resins such as starch, gelatin and corn starch. They can beused alone or in a mixture of two or more kinds thereof, and a contentthereof is 5 to 50% by weight, preferably 10 to 40% by weight based onthe total amount of the composition.

[0023] The gelling agent used in the embodiment of the present inventionshall not specifically be restricted, and gelling agents which have sofar been used for solid adhesives can be used. They include, forexample, condensation products obtained by condensing benzaldehyde withtetra- to hexahydric aliphatic polyhydric alcohols, such assorbit.benzaldehyde condensation products and xylit.benzaldehydecondensation products, alkali metal salts or ammonium salts of fattyacids having 8 to 36 carbon atoms, N-lauroyl-glutamic acid-α,γ-di-n-butyramide, dextrin fatty acid esters, fatty acid amides, organicbentonite, aluminum silicate and silica. They can be used alone or in amixture of two or more kinds thereof.

[0024] The gelling agent has a content of 0.1 to 15% by weight,preferably 1 to 10% by weight based on the total amount of thecomposition.

[0025] The solvent used in the embodiment of the present invention shallnot specifically be restricted, and solvents which have so far been usedfor solid adhesives can be used. They include, for example, loweralcohols such as ethyl alcohol, propyl alcohol and isopropyl alcohol,aromatic hydrocarbons such as toluene and xylene, lower aliphaticketones such as methyl ethyl ketone and methyl isobutyl ketone, estersof a lower alcohol with a lower fatty acid such as ethyl acetate andbutyl acetate, aliphatic hydrocarbons such as hexane and heptane,alicyclic hydrocarbons such as cyclohexane and ethylcyclohexane andglycol ethers such as propylene glycol monomethyl ether and propyleneglycol monoethyl ether. They can be used alone or in a mixture of two ormore kinds thereof, and a content thereof is 30 to 90% by weight,preferably 40 to 70% by weight based on the total amount of thecomposition.

[0026] The solvent described above may be a mixture of water and asolvent. A moisture content in the solid adhesive composition ispreferably 0.1 to 15% by weight, more preferably 1.0 to 10% by weightbased on the total amount of the composition in terms of sufficientlyexhibiting the effect of the present invention that the solid adhesivecomposition of the present invention has an excellent applyingperformance even after it is left to stand in the atmosphere for a longtime.

[0027] If the moisture content is less than 0.1% by weight, the effectsof the present invention can not be exhibited. On the other hand, if itexceeds 15% by weight, reduction in the adhesive performance is causedbecause of deterioration in the drying property. Accordingly, neitherare preferred.

[0028] The waxes used in the first and third embodiments of the presentinvention are a solid at room temperature (25° C., hereinafter the sameshall apply) and have a solubility of 20% or less, preferably 10% orless and more preferably 5% or less in the solvent at room temperature.The lower limit value thereof includes 0% and is preferably 0.1% ormore, more preferably 1% or more.

[0029] The waxes exhibiting this solubility characteristic include, forexample, waxes such as paraffin waxes, olefin waxes, microcrystallinewaxes, petrolatum, animal waxes, vegetable waxes, mineral waxes,polyethylene waxes and Fisher.Tropsch waxes, and they can be used aloneor in a mixture of two or more kinds thereof.

[0030] Waxes which are a liquid at room temperature or those which havea solubility exceeding 20% in the solvent at room temperature are elutedin the solvent by virtue of dissolution or diffusion action, and theeffect of the present invention is lowered during storage over a longperiod of time or the effect is lost as the solid adhesive compositionis used, so that the objects of the present invention can not beachieved.

[0031] A solubility of 20% or less in the solvents described above meansthat the waxes have a solubility of 20% or less in the solvents used inthe present invention at room temperature.

[0032] The waxes satisfying the solubility described above havepreferably a melting point (mp) of 35 to 75° C. in order to achievefurther effects of the present invention.

[0033] The waxes in the first embodiment have a content of 0.1 to 15% byweight, preferably 1.0 to 10% by weight based on the total amount of thecomposition.

[0034] If the waxes have a content of less than 0.1% by weight, theeffects of the present invention can not be exhibited. On the otherhand, if it exceeds 15% by weight, the adhesive performance is reduced,and cohesive failure takes place. Accordingly, neither are preferred.

[0035] The substance, which is used in the second and third embodimentsof the present invention, absorbing moisture contained at least in theatmosphere and/or the adhesive composition to form anevaporation-inhibiting film is one or a mixture of two or more selectedfrom the group consisting of glycerin fatty acid esters such as glycerinmonostearate, glycerin distearate, glycerin monooleate and glycerinmonolaurate, polyglycerin fatty acid esters such as diglycerinmonostearate, triglycerin monostearate, pentaglycerin distearate,hexaglycerin tristearate and decaglycerin distearate, alkyl phosphatessuch as polyoxyethylenestearyl phosphate, polyoxyalkylene fatty acidesters such as polyoxyethylene monostearate, polyoxyethylene distearate,polyoxyethylene monolaurate and polyoxyethylene monooleate, sorbitanfatty acid esters such as sorbitan monostearate and sorbitantristearate, polyoxyethylene sorbitan fatty acid esters such aspolyoxyethylene sorbitan monostearate and polyoxyethylene sorbitantristearate, sorbit fatty acid esters such as sorbit distearate andsorbit tristearate, polyoxyethylene sorbit fatty acid esters such aspolyoxyethylene sorbit hexastearate, pentaerythritol derivatives such aspentaerythritol monostearate and pentaerythritol distearate, lecithin,sucrose esters, stearyl ascorbate and sorbitan stearate.

[0036] The substances which are a solid at room temperature and have asolubility of 10% or less in the solvent is preferred in terms of adegree of easiness in forming the film and a degree of quickness in thefilm-forming time.

[0037] The substance forming an evaporation-inhibiting film in thesecond embodiment has a content of 0.01 to 10% by weight, preferably0.03 to 5% by weight based on the total amount of the composition.

[0038] If this substance forming an evaporation-inhibiting film has acontent of less than 0.01% by weight, the effects of the presentinvention can not be exhibited. On the other hand, if it exceeds 10% byweight, the adhesive performance is reduced, and cohesive failure takesplace. Accordingly, neither are preferred.

[0039] In the third embodiment of the present invention, in the solidadhesive composition comprising at least the adhesive component, thegelling agent and the solvent, used in combination in the abovecomposition are two components which are at least one selected from thegroup consisting of waxes such as paraffin waxes and olefin waxes whichare a solid at room temperature and have a solubility of 20% or less inthe solvent at room temperature and a substance absorbing moisturecontained at least in the atmosphere and/or the adhesive composition toform an evaporation-inhibiting film, and a content ratio of the waxes tothe substance forming an evaporation-inhibiting film and the totalcontent thereof are controlled to the specific ranges, whereby capableof being prepared is the solid adhesive composition exhibiting anexcellent applying performance for a further longer time as comparedwith the compositions in which the above two asmponents each are addedalone in the first and second embodiments described above.

[0040] A content ratio [(A)/(B)] of the waxes (A) to the substance (B)absorbing moisture contained at least in the atmosphere and/or theadhesive composition to form an evaporation-inhibiting film is 1/1 to100/1, preferably 2/1 to 50/1 in terms of a weight ratio, and the totalcontent thereof is 0.1 to 10% by weight, preferably 1 to 5% by weightbased on the total amount of the composition.

[0041] If a content ratio [(A)/(B)] of the waxes (A) to the substance(B) forming an evaporation-inhibiting film falls outside a range of 1/1to 100/1 in terms of a weight ratio or the total content thereof fallsoutside a range of 0.1 to 10% by weight, further effects brought aboutby combined use of the two components can not be obtained.

[0042] Further, in the present invention, capable of being added asadditives for the solid adhesive composition are various additives whichhave so far been used for solid adhesive compositions, for example,water, colorants, perfumes, fungicides, lubricants, wetting agents,extenders and antiseptics.

[0043] The solid adhesive composition of the present invention can beproduced by stirring and mixing the adhesive component, the gellingagent, the solvent, various kinds of the waxes and/or various kinds ofthe substances forming an evaporation-inhibiting film each describedabove by a conventional method, leaving the mixture to be cooled andsolidified.

[0044] In the present invention, capable of being achieved is the solidadhesive composition having an excellent applying performance even afteran applying part of the solid adhesive is left to stand in theatmosphere for a long time. In particular, when it is applied to afeeding vessel (stick type) equipped with a cap shown in FIG. 1, capableof being achieved is the solid adhesive composition having an excellentcap-off performance which exhibits an excellent applying performanceeven after the cap is detached to leave an applying part of the solidadhesive to stand in the atmosphere for a long time.

[0045] To briefly explain the feeding vessel (stick type) equipped witha cap shown in FIG. 1 in which the solid adhesive composition is loaded,10 is a vessel body; 11 is a rotating part; 12 is a screw bar; 13 is apan for receiving a solid adhesive composition 20; and 14 is a cap. Inapplying, the cap 14 is detached, and the rotating part 11 is rotated,whereby the pan 13 goes upward by screwing action with the screw bar,and this allows an applying part 21 at a tip of the solid adhesivecomposition 20 to go upward to be used for applying. When retracting it,the pan goes downward by rotating the rotating part 11 in a directioninverse to that in applying as described above, and the solid adhesivecomposition 20 is retracted in the vessel body 10.

[0046] Inferred as follows is a reason why the solid adhesivecomposition of the present invention has an excellent applyingperformance even after an applying part of the solid adhesive is left tostand in the atmosphere for a long time. However, the action mechanismsin the respective embodiments are a little different in a functionthereof as described later.

[0047] In the solid adhesive composition prepared by adding variouskinds of the waxes exhibiting the solubility characteristic describedabove to the solid adhesive composition comprising at least the adhesivecomponent, the gelling agent and the solvent in the first embodiment,the waxes contained in the solid adhesive composition are dried when anapplying part of the above solid adhesive is left to stand in theatmosphere to form a very fragile film (evaporation-inhibiting film),and this film prevents the solvent which is a volatile componentcontained in the solid adhesive composition from evaporating. On theother hand, the above film is broken by an applying pressure in applyingto make applying of the adhesive composition possible. Furthermore, arequired amount of the waxes contained in the solid adhesive compositionis always present in the applying part, and therefore a new film isformed on the surface of the applying part with drying when the applyingpart is exposed to the atmosphere again. This cycle of filmformation→applying→film formation→applying - - - produces repeatedly aneffect many times. This makes the surface of the applying part lessliable to be hardened when the applying part of the above solid adhesiveis left to stand in the atmosphere for a long time to provide theexcellent applying performance.

[0048] In the solid adhesive composition prepared by adding thesubstance forming an evaporation-inhibiting film to the solid adhesivecomposition comprising at least the adhesive component, the gellingagent and the solvent in the second embodiment, moisture contained inthe atmosphere and/or the solid adhesive composition is absorbed in thesubstance forming an evaporation-inhibiting film when an applying partof the above solid adhesive is left to stand in the atmosphere; to bespecific, the solvent evaporates from the surface of the solid adhesive,and heat is deprived in evaporation, so that a temperature on thesurface is lowered; moisture contained in the atmosphere and/or thecomposition is deposited in the vicinity of the surface of the solidadhesive composition to form a very fragile film [liquid crystal surfacefilm (evaporation-inhibiting film)] on the applying part (surface) asthe composition in the vicinity of the surface changes; and this filmprevents the solvent which is a volatile component contained in thesolid adhesive composition from evaporating. On the other hand, theabove film is broken by an applying pressure in applying to makeapplying of the adhesive composition possible. Further a required amountof the substance forming an evaporation-inhibiting film contained in thesolid adhesive composition is always present in the applying part, andtherefore when the applying part is exposed to the atmosphere again,moisture contained in the atmosphere and/or the solid adhesivecomposition is absorbed in the same manner as described above to form anew film on the surface of the applying part. This cycle of filmformation→applying→film formation→applying - - - produces repeatedly aneffect many times. This makes the surface of the applying part lessliable to be hardened when the applying part of the solid adhesive isleft to stand in the atmosphere for a long time to provide the excellentapplying performance.

[0049] When moisture is contained in the solid adhesive composition, theeffect is exhibited even when the humidity is low, but if it is toomuch, reduction in the adhesive performance is caused because ofdeterioration in the drying property.

[0050] In the solid adhesive composition prepared by adding variouskinds of the waxes having the characteristic described above and variouskinds of the substances forming an evaporation-inhibiting film describedabove to the solid adhesive composition comprising at least the adhesivecomponent, the gelling agent and the solvent in the third embodiment,the waxes contained in the solid adhesive composition are dried, andmoisture contained in the atmosphere and/or the solid adhesivecomposition is absorbed in the substance forming anevaporation-inhibiting film when an applying part of the above solidadhesive is left to stand in the atmosphere, whereby a very fragilecomposite film (evaporation-inhibiting composite film) is formed.

[0051] No theory on the embodiment of forming this composite film isestablished, but it is inferred that (1) a film formed by the waxesalone is a little imperfect, and fine pores are considered to be presenton the above film; and the composite film is formed by filling up(forming a film) these fine pores with the evaporation-inhibitingsubstance or (2) a crystalline structure of the film becomes fine(minute) by blending the evaporation-inhibiting substance having astructure similar to those of the waxes (the aboveevaporation-inhibiting substance acts as a substance having action ofenhancing fluidity), whereby the composite film is formed.

[0052] The solvent which is a volatile component contained in the solidadhesive composition is prevented from evaporating by this compositefilm more surely than in the solid adhesive composition in the first andsecond embodiments described above. The above composite film is brokenby an applying pressure in applying to make applying of the adhesivecomposition possible. Furthermore the required amounts of the waxes andthe substance forming an evaporation-inhibiting film contained in thesolid adhesive composition are always present in the applying part, andtherefore when the applying part is exposed to the atmosphere again, anew composite film is formed on the surface of the applying part. Thiscycle of composite film formation→applying→composite filmformation→applying - - - produces repeatedly an effect many times. Thismakes the surface of the applying part less liable to be hardened whenthe applying part of the solid adhesive is left to stand in theatmosphere for a long time to provide more excellent applyingperformance.

[0053] The solid adhesive composition of the present invention isconstituted in the manner described above but shall not be restricted tothe embodiments described above, and other embodiments can be carriedout with variety as long as they fall in the technical concept of thepresent invention.

[0054] For example, the kinds and the blending compositions of theadhesive component, the gelling agent and the solvent each describedabove can suitably be changed according to the uses of the solidadhesive composition, for example, a solid adhesive composition foroffice uses, a solid adhesive composition for garters and a solidpressure sensitive adhesive composition.

[0055] In the present invention, particularly when the solid adhesivecomposition of the present invention is applied to a screw-feedingvessel (stick type) equipped with a cap shown in FIG. 1 or a push-outvessel (not illustrated) equipped with a cap, the applying part is lessliable to be hardened even when it is in the state that it is left tostand as it is without putting the cap thereon after applying, and thesolid adhesive composition which has an excellent applying performanceand which is excellent in a cap-off performance can be achieved.

EXAMPLES

[0056] Next, the present invention shall be explained in further detailswith reference to examples and comparative examples, but the presentinvention shall not be restricted to the following examples.

Examples 1 to 7 and Comparative Examples 1 to 3

[0057] The respective components were stirred and blended at 120° C. informulations shown in the following Table 1 to prepare stick-shapedsolid adhesive compositions.

[0058] A solubility of paraffin wax in a solvent (ethyl alcohol andpropylene glycol monomethyl ether) was 0.01% at room temperature andthat of hexaglycerin tristearate was 0.5%.

[0059] The respective solid adhesive compositions thus obtained wereevaluated for adhesive performances based on a change with the passageof time and an initial adhesive performance by the following evaluationmethods. The results thereof are shown in the following table 2.

[0060] Evaluation Method of Applying Performance

[0061] The applying performances of the solid adhesive compositionsbased on a change with the passage of time under an environment of 25°C./65% RH were evaluated according to the following evaluation criteria.

[0062] Evaluation Criteria

[0063] ⊚: can be applied by light touch

[0064] ◯: can be applied without blurring

[0065] Δ: blurred but can be applied

[0066] ×: can not be applied at all

[0067] Evaluation Method of Initial Adhesive Performance

[0068] A test piece (3×6 cm) was adhered, and this test piece was peeledoff after fixed time (one minute) to evaluate the degree of rupture ofthe paper according to the following evaluation criteria.

[0069] Evaluation Criteria

[0070] ⊚: paper rupture is caused

[0071] ◯: paper rupture is partially caused

[0072] Δ: adhered, but paper rupture is not caused

[0073] ×: not adhered at all TABLE 1 Solid adhesive compositionComparative Example Example 1 2 3 4 5 6 7 1 2 3 Ethyl alcohol 5.0 5.05.0 31.5 31.5 7.5 7.5 5.0 5.0 5.0 Propylene glycol monomethyl ether 45.540.5 55.49 10.00 5.0 48.97 51.4 55.5 45.5 45.5 Sorbit • benzaldehydecondensation 8.0 8.0 8.0 8.0 8.0 — — 8.0 8.0 8.0 product *1 Xylit •benzaldehyde condensation — — — — — 10.0 10.0 — — — productPolyvinylpyrrolidone K-90 *2 6.0 6.0 6.0 6.0 6.0 5.0 5.0 6.0 6.0 27.0Polyvinylpyrrolidone K-90 *3 25.0 25.0 25.0 39.0 39.0 25.0 25.0 25.025.0 4.0 Perfume 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 Paraffin wax *410.0 15.0 0.01 — — 3.0 0.3 — — — Hexaglycerin tristearate — — — 5.0 10.00.03 0.3 — — — Glycerin — — — — — — — — 10.0 10.0 Moisture content (%)in solid 1.0 1.0 1.0 5.0 15.0 1.0 2.0 1.0 6.0 20.0 adhesive composition

[0074] TABLE 2 Evaluation of applying performance based Initial on achange with the passage of time adhesive 10 min 1 hour 3 hours 6 hours12 hours 1 day 3 days 5 days 1 week performance Example 1 ⊚ ⊚ ⊚ ⊚ ⊚ ⊚ ⊚◯ Δ ⊚ Example 2 ⊚ ⊚ ⊚ ⊚ ⊚ ⊚ ⊚ ⊚ ◯ ◯ Example 3 ⊚ ⊚ ⊚ ⊚ ⊚ ⊚ ◯ Δ Δ ⊚Example 4 ⊚ ⊚ ⊚ ⊚ ⊚ ⊚ ⊚ ◯ Δ ◯ Example 5 ⊚ ⊚ ⊚ ⊚ ⊚ ⊚ ⊚ ⊚ ◯ Δ Example 6 ⊚⊚ ⊚ ⊚ ⊚ ⊚ ⊚ ⊚ ⊚ ⊚ Example 7 ⊚ ⊚ ⊚ ⊚ ⊚ ⊚ ⊚ ⊚ ◯ ⊚ Comparative X X ⊚Example 1 Comparative ◯ Δ X ◯ Example 2 Comparative ⊚ ◯ X X Example 3

[0075] As apparent from the results shown in Table 1 and Table 2described above, it has been found that the solid adhesive compositionsprepared in Examples 1 to 7 falling in the scope of the presentinvention are excellent in an initial adhesive performance and have anexcellent applying performance even after exposing the solid adhesivecompositions to the atmosphere for a long time as compared with thesolid adhesive compositions prepared in Comparative Examples 1 to 3falling outside the scope of the present invention.

[0076] It has been found that in particular, the solid adhesivecompositions prepared in Examples 6 and 7 in which the waxes were usedin combination with the substance absorbing moisture contained at leastin the atmosphere and/or the solid adhesive composition to form anevaporation-inhibiting film are further excellent in an initial adhesiveperformance and have an excellent applying performance even afterexposing the solid adhesive compositions to the atmosphere for a longtime (5 days or longer) as compared with the solid adhesive compositionsprepared in Examples 1 to 5 in which the waxes were added alone or thesubstance forming an evaporation-inhibiting film was added alone.

[0077] In contrast with this, it has been found that in ComparativeExamples 1 to 3 in which not used were the waxes and/or the substanceabsorbing moisture contained at least in the atmosphere and/or the solidadhesive composition to form an evaporation-inhibiting film, neither ofthe initial adhesive performance and the applying performance with thepassage of time can be satisfied.

INDUSTRIAL APPLICABILITY

[0078] According to the present invention, provided is a solid adhesivecomposition having an excellent applying performance even after theapplying part is left to stand in the atmosphere for a long time, and itcan be applied to an adhesive for office uses of a stick type, anadhesive for garters and a solid pressure sensitive adhesive.

What is claimed is:
 1. A solid adhesive composition comprising at leastan adhesive component, a gelling agent and a solvent, wherein containedin said composition is at least one selected from the group consistingof waxes which are a solid at room temperature and have a solubility of20% or less in the solvent at room temperature.
 2. A solid adhesivecomposition having an excellent cap-off performance, comprising at leastan adhesive component, a gelling agent and a solvent, wherein containedin said composition is a substance absorbing moisture contained at leastin the atmosphere and/or the adhesive composition to form anevaporation-inhibiting film.
 3. A solid adhesive composition comprisingat least an adhesive component, a gelling agent and a solvent, whereincontained in said composition are at least one selected from the groupconsisting of waxes which are a solid at room temperature and have asolubility of 20% or less in the solvent at room temperature and asubstance absorbing moisture contained at least in the atmosphere and/orthe adhesive composition to form an evaporation-inhibiting film.
 4. Thesolid adhesive composition as described in claim 1 or 3, wherein thewaxes which are a solid at room temperature and have a solubility of 20%or less in the solvent at room temperature are at least one selectedfrom the group consisting of paraffin waxes, olefin waxes,microcrystalline waxes, petrolatum, animal waxes, vegetable waxes,mineral waxes, polyethylene waxes and Fisher.Tropsch waxes.
 5. The solidadhesive composition as described in claim 2 or 3, wherein the substanceabsorbing moisture contained at least in the atmosphere and/or theadhesive composition to form an evaporation-inhibiting film is at leastone selected from the group consisting of glycerin fatty acid esters,polyglycerin fatty acid esters, alkyl phosphates, polyoxyalkylene fattyacid esters, sorbitan fatty acid esters, polyoxyalkylene sorbitan fattyacid esters, sorbit fatty acid esters, polyoxyalkylene sorbit fatty acidesters and lecithin.
 6. The solid adhesive composition as described inclaim 1 or 4, wherein the waxes have a content of 0.1 to 15% by weightbased on the total amount of the composition.
 7. The solid adhesivecomposition as described in claim 2 or 5, wherein the substanceabsorbing moisture contained at least in the atmosphere and/or theadhesive composition to form an evaporation-inhibiting film has acontent of 0.01 to 10% by weight based on the total amount of thecomposition.
 8. The solid adhesive composition as described in any ofclaims 3 to 5, wherein a content ratio of the waxes to the substanceabsorbing moisture contained at least in the atmosphere and/or theadhesive composition to form an evaporation-inhibiting film is 1/1 to100/1 in terms of a weight ratio, and the total content thereof is 0.1to 10% by weight based on the total amount of the composition.